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Title:
LOW HEAT-SHRINKABLE AND HIGHLY ADHESIVE POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2007177030
Kind Code:
A
Abstract:

To provide a polyimide film which has improved heat shrinkability and improved adhesiveness.

This polyimide film produced by applying an electrical discharge treatment to a polyimide film formed from 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride and then applying a heating treatment to the treated polyimide film, while constantly keeping a tension in the longitudinal direction of the film, is characterized in that a surface free energy measured on the basis of a contact angle method is ≥80 mN/m, and a thermal shrinkage rate at 200°C for hour time is ≤0.10%.


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Inventors:
YAMASHITA SHINSUKE
ISHIKAWA HIRONORI
YASUDA MASABUMI
Application Number:
JP2005375368A
Publication Date:
July 12, 2007
Filing Date:
December 27, 2005
Export Citation:
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Assignee:
TORAY DU PONT KK
International Classes:
C08J5/18; C08G73/10; C08J7/00; C09J7/00; C09J179/08
Attorney, Agent or Firm:
Tomonori Iwami



 
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