Title:
低挿入損失ＲＦ伝送線路
Document Type and Number:
Japanese Patent JP6976409
Kind Code:
B2
Abstract:
The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
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Inventors:
Popovich mark
Fleming Jeb H.
Barrington Jeff A.
Fleming Jeb H.
Barrington Jeff A.
Application Number:
JP2020504412A
Publication Date:
December 08, 2021
Filing Date:
May 29, 2019
Export Citation:
Assignee:
3D GLASS SOLUTIONS,INC
International Classes:
H05K1/03; C03C3/091; C03C3/093; C03C3/105; C03C3/108; C03C4/04; C03C15/00; C03C17/06; H01L23/15; H01P3/08; H01P11/00; H03H7/01; H05K9/00
Domestic Patent References:
| JP2016528735A | ||||
| JP3232293A | ||||
| JP2001144488A | ||||
| JP2016539067A | ||||
| JP2006245518A | ||||
| JP2001105398A | ||||
| JP2017204527A |
Foreign References:
| US20150049498 |
Attorney, Agent or Firm:
Masaki Hirota
Seiji Ozawa
Yusaku Tokai
Yasunori Matsuhashi
Makoto Horiuchi
Masako Yamauchi
Shuichi Sonomoto
Akihiro Yamamura
Hiroyuki Tomita
Seiji Ozawa
Yusaku Tokai
Yasunori Matsuhashi
Makoto Horiuchi
Masako Yamauchi
Shuichi Sonomoto
Akihiro Yamamura
Hiroyuki Tomita