Title:
低分子量エチレンインターポリマー、その製造法および使用
Document Type and Number:
Japanese Patent JP5307552
Kind Code:
B2
Abstract:
The invention provides a comprising one or more ethylene interpolymers, and wherein the interpolymers, or the composition, has a melt viscosity from 1 to 30,000 cP at 177° C., and wherein at least one ethylene interpolymer has an Rv from 0.3 to 0.99. The invention further provides a composition comprising at least one low molecular weight (LMW) ethylene interpolymer, and at least one high molecular weight (HMW) ethylene interpolymer, and wherein the composition has a melt viscosity from 1 to 30,000 cP at 177° C., and wherein the sum of the Rv from the low molecular weight interpolymer and the high molecular weight interpolymer is from 0.3 to 2. The invention further provides for processes of making such compositions, processes for functionalizing the interpolymer(s) of such compositions, and articles comprising at least one component prepared from an inventive composition.
Inventors:
Kajara, Teresa, Pea.
Yerberts, Selim
Ricky, Cynthia, Elle.
Desjardins, Sylvie
Springs, Mark, A.
Yerberts, Selim
Ricky, Cynthia, Elle.
Desjardins, Sylvie
Springs, Mark, A.
Application Number:
JP2008548550A
Publication Date:
October 02, 2013
Filing Date:
December 12, 2006
Export Citation:
Assignee:
Dow Global Technologies LLC
International Classes:
C08L23/08; C08F8/00; C08F210/16
Domestic Patent References:
| JP2003073412A | ||||
| JP8134147A | ||||
| JP2004536895A | ||||
| JP2004527612A | ||||
| JP2006137873A |
Foreign References:
| WO2005103095A1 |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Norio Omori
Yasuhito Suzuki
Eiji Katayama
Norio Omori
Yasuhito Suzuki
Previous Patent: 自己要因による組織の移動の補正方法及びシステム
Next Patent: WORKING INFORMATION INPUT DEVICE FOR CONSTRUCTION WORKS
Next Patent: WORKING INFORMATION INPUT DEVICE FOR CONSTRUCTION WORKS