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Title:
LOW MOLECULAR WEIGHT AND FLEXIBLE MODIFIED-POLYPROPYLENE AND RESIN COMPOSITION FOR TACKY HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2004307838
Kind Code:
A
Abstract:

To provide a base polymer suitable for a tacky hot-melt adhesive which is easily applicable, capable of applying in high precision and excellent in high speed applicability, and has excellent adhesive force even for a combination of same or different kinds of various materials such as polyolefin resins, engineering plastics and inorganic materials.

This low molecular weight and flexible modified-polypropylene is obtained by radically reacting 100 pts.mass of a flexible polypropylene (A) with 0.2-15 pts.mass of an unsaturated carboxylic acid (B) or its derivative and 0.01-2.0 pts.mass of an organic peroxide (C), where the content of the unsaturated carboxylic acid or its derivative is 0.05-15 mass% and the intrinsic viscosity [η] measured in a tetralin solvent at 135°C is 0.05-1.5 dL/g. The resin composition for the tacky hot-melt adhesive uses the resin.


Inventors:
TATSUMI FUMIO
YUYA AKIRA
Application Number:
JP2004073758A
Publication Date:
November 04, 2004
Filing Date:
March 16, 2004
Export Citation:
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Assignee:
IDEMITSU PETROCHEMICAL CO
International Classes:
C09J151/06; C08F8/46; C09J191/06; C09J201/00; (IPC1-7): C08F8/46; C09J151/06; C09J191/06; C09J201/00
Domestic Patent References:
JP2777436B21998-07-16
JPH026513A1990-01-10
JPH08319324A1996-12-03
JPS59217709A1984-12-07
Attorney, Agent or Firm:
Tamotsu Otani
Masamichi Tohei