PURPOSE: To provide low-residue cream solder for nitrogen reflow which is greatly ameliorated in thinning at the time of continuous printing, clogging, tacky adhesion with lapse of time and production of solder balls by preheating sagging occurring in a solvent and thioxotropic agent.
CONSTITUTION: The cream solder flux contains the N-substd. fatty acid amide expressed by the following general formula I and/or formula II as the thixotropic agent and a branched aliphat. alcohol having the distillation point lower than the m.p. of the solder and low hygroscopicity and an arom. alcohol having low hygroscopicity as the solvent: R1CONHR2NHCOR1...I. R3NHCOR4 CONHR3...II (where, R1 denotes an alkyl group of a fatty acid, R2 denotes a hydrocarbon of diamine, R3 denotes an alkyl group of an aliphat. amine, R4 denotes a hydrocarbon of a dicarboxylic acid).
UDONO NAOYASU
KATO KIYOSHI
TAKITA KAN
SHIMOKAWA KOICHI
SHIRAI TAKESHI
SASAKI YASUYUKI
WATANABE KATSUHIRO
MATSUI KENJI
KOKI KK
SANEI KAGAKU KK
| JPH02165897A | 1990-06-26 | |||
| JPH04220192A | 1992-08-11 | |||
| JPH05123891A | 1993-05-21 | |||
| JPS60170594A | 1985-09-04 | |||
| JPS63281794A | 1988-11-18 | |||
| JPS6333196A | 1988-02-12 |
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