Title:
LOW SHRINKABLE HEAT-BONDING FIBER
Document Type and Number:
Japanese Patent JP2006207084
Kind Code:
A
Abstract:
To provide a low shrinkable hot-bonding fiber which can give a nonwoven fabric having excellent dimensional stability and flexibility without deteriorating the characteristics of a main fiber.
This low shrinkable hot-bonding fiber comprising a low melting point polyester having a melting point or flow-starting temperature of ≤200°C is characterized in that at least the surface of the fiber comprises a crystalline low melting point polyester having a crystallization-starting temperature of 80 to 140°C and a melting point of 160 to 200°C, and the fiber has a dry heat shrinkage percentage of ≤10%, when thermally treated at 120°C.
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Inventors:
EZUKA TOSHISHIGE
WATANABE HIROYUKI
WATANABE HIROYUKI
Application Number:
JP2005023283A
Publication Date:
August 10, 2006
Filing Date:
January 31, 2005
Export Citation:
Assignee:
NIPPON ESTER CO LTD
International Classes:
D01F8/14
Domestic Patent References:
JP2004270044A | 2004-09-30 | |||
JP2003253525A | 2003-09-10 |