Title:
低表面エネルギーCMPパッド
Document Type and Number:
Japanese Patent JP4955535
Kind Code:
B2
Abstract:
The invention provides a polishing pad substrate comprising a copolymer, wherein the copolymer has at least one hydrophilic repeat unit and at least one hydrophobic repeat unit. The invention also provides a polishing pad substrate comprising a polymer, wherein the polymer is a modified polymer having at least one hydrophilic unit and at least one hydrophobic unit attached to the polymer chain. The invention further provides a method of polishing a workpiece comprising (i) providing a workpiece to be polished, (ii) contacting the workpiece with a chemical-mechanical polishing system comprising the polishing pad substrate of the invention, and (iii) abrading at least a portion of the surface of the workpiece with the polishing system to polish the workpiece.
Inventors:
Prasad, Avaneshwar
Application Number:
JP2007505002A
Publication Date:
June 20, 2012
Filing Date:
March 14, 2005
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
H01L21/304; B24B37/013; B24B37/24; B24D3/00; B24D3/30; B24D11/00; B24D13/14
Domestic Patent References:
| JP2004179664A | ||||
| JP2002535843A | ||||
| JP11320373A |
Foreign References:
| WO2003068883A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Masatoshi Takahashi
Takashi Ishida
Tetsuji Koga
Masatoshi Takahashi