Title:
LOW-TEMPERATURE BURNED CERAMIC CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3124697
Kind Code:
B2
Abstract:
PURPOSE: To improve a wire bonding operation in reliability by a method wherein an Au conductor pad is formed on the surface of a ceramic board burned below a specific temperature through the intermediary of an Ag surface conductor.
CONSTITUTION: An Ag surface conductor 16 is formed on the surface of a low-temperature burned ceramic board 11 where an inner layer 15 and viahole conductors 14 both formed of Ag conductor burned below a temperature of 1000° are provided and burned at the same time, and a wire bonding pad 17 of Au is formed on the surface conductor 16 of Ag. By this setup, a bonding wire can be enhanced in bonding strength at a joint between conductor and ceramic to restrain cratering from occurring, an ultrasonic bonder of higher ultrasonic power can be used, and a wire bonding operation can be enlarged in degree of freedom of bonding condition. Moreover, as the Ag surface conductor 16 is capable of being burned together with the ceramic board 11, a manufacturing process can be shortened so a to meet requirements.
Inventors:
Koji Shibata
Inoue Norie
Inoue Norie
Application Number:
JP6535995A
Publication Date:
January 15, 2001
Filing Date:
March 24, 1995
Export Citation:
Assignee:
Sumitomo Metal Electro Device Co., Ltd.
International Classes:
H05K1/09; H05K1/03; H05K3/24; H05K3/46; H05K1/00; (IPC1-7): H05K3/46; H05K1/03; H05K1/09; H05K3/24
Domestic Patent References:
| JP685466A | ||||
| JP6334351A | ||||
| JP2128496A |
Attorney, Agent or Firm:
Muneo Kako