LOW-TEMPERATURE CURABLE CONDUCTIVE PASTE FOR PLATING AND ELECTRIC WIRING USING THE SAME

Title:

LOW-TEMPERATURE CURABLE CONDUCTIVE PASTE FOR PLATING AND ELECTRIC WIRING USING THE SAME

Document Type and Number:

Japanese Patent JP2010102988

Kind Code:

A

Abstract:

To provide a conductive paste that is excellent in low-temperature curability, platability, and printability and to form an excellent circuit by being applied with plating, and an electric wiring using the same.

The conductive paste contains conductive powder (A), vinyl chloride-vinyl acetate resin (B), polyester resin and/or a polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E). The resin (C) has a glass transition temperature of -50C and 20C. A total amount of the resin (C) is 50-400 pts.wt. per 100 pts.wt. of the resin (B) while a total amount of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10-60 pts.wt. per 100 pts.wt. of the conductive powder (A). An electric wiring is configured such that the conductive paste is formed on an insulating substrate.

Inventors:

AKIBA YUICHIRO
HONDA TOMOKO
TAKAHASHI FUJIO
NAKADA SHINJI

Application Number:

JP2008274230A

Publication Date:

May 06, 2010

Filing Date:

October 24, 2008

Export Citation:

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Assignee:

TOYO BOSEKI
TOSHIBA CORP

International Classes:

H01B1/22; H01B1/00; H01B5/14; H01B13/00; H01Q1/38; H05K1/09; H05K3/12; H05K3/24

Domestic Patent References:

JP2005056778A	2005-03-03
JP2003223812A	2003-08-08
JP2002097422A	2002-04-02
JP2007149631A	2007-06-14
JPS6335667A	1988-02-16

Attorney, Agent or Firm:

Nobuaki Kazehaya
Noriko Asano

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