Title:
低温硬化性エポキシテープ及びその製造方法
Document Type and Number:
Japanese Patent JP5818893
Kind Code:
B2
Abstract:
A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.
Inventors:
Prout, David Jay.
Azalea, Shawn M.
On, Ching Tong
Lee, Xiang Kwan
Azalea, Shawn M.
On, Ching Tong
Lee, Xiang Kwan
Application Number:
JP2013525984A
Publication Date:
November 18, 2015
Filing Date:
August 17, 2011
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
C09J7/21; C09J7/35; C09J11/06; C09J163/00
Domestic Patent References:
| JP49047024B1 | ||||
| JP2002518579A | ||||
| JP2005232207A | ||||
| JP5209157A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Yasuki Yanagi
Yoshinori Shimizu
Yasuki Yanagi