Title:
低温焼結性銅粒子とそれを用いた焼結体の製造方法
Document Type and Number:
Japanese Patent JP7006872
Kind Code:
B2
Abstract:
To provide novel low-temperature sinterable copper particles that can be sintered even at a low temperature of, for example, around 100°C or less, and a method for producing a sintered body by using the same. The low-temperature sinterable copper particles according to the present invention are coated with a carboxylic acid, and a surface of the copper particle is oxidized so as to have a cuprous oxide fraction (Cu2O/(Cu + Cu2O)) in the copper particle of 4% by mass or less or so as to have an average coating thickness of cuprous oxide of 10 nm or less. The low-temperature sinterable copper particles are subjected to low-temperature firing in an atmosphere of 0.01 Pa or less.
Inventors:
Toru Yonezawa
Hiroki Tsukamoto
Hiroki Tsukamoto
Application Number:
JP2019556446A
Publication Date:
January 24, 2022
Filing Date:
November 29, 2017
Export Citation:
Assignee:
National University Corporation Hokkaido University
International Classes:
B22F1/00; B22F1/14; B22F1/16; B22F3/10; C22C1/04
Domestic Patent References:
| JP2016069716A |
Foreign References:
| WO2016031860A1 |
Attorney, Agent or Firm:
Yuki Ono
Toshio Nishizawa
Toshio Nishizawa