LOW THERMAL EXPANSION CERAMIC JOINED BODY

Title:

LOW THERMAL EXPANSION CERAMIC JOINED BODY

Document Type and Number:

Japanese Patent JP2005035839

Kind Code:

A

Abstract:

To provide a low thermal expansion ceramic joined body having low thermal expansion coefficient, no residual internal stress in the joined part, rigidity comparable to that of a conventional ceramic and high joining strength.

The low thermal expansion ceramic joined body is formed by joining a base material composed of a low thermal expansion ceramic with a joining material composed of a low thermal expansion ceramic having a melting temperature lower than that of the base material. The average coefficient of thermal expansion of the base material and the joining material at 20-30°C is -1×10-6 to 1×10-6 /°C and the joining material is constituted of a composite material composed of lithium aluminosilicate, nitride and magnesium oxide.

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Inventors:

ISHII MAMORU
IGUCHI MASAHITO
KATAOKA MASAKO
UMETSU MOTOHIRO
NAKAMURA HIROAKI

Application Number:

JP2003274442A

Publication Date:

February 10, 2005

Filing Date:

July 15, 2003

Export Citation:

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Assignee:

TAIHEIYO CEMENT CORP

International Classes:

C04B37/00; (IPC1-7): C04B37/00

Attorney, Agent or Firm:

Hiroshi Takayama

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