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Title:
発光デバイスおよび同製造方法
Document Type and Number:
Japanese Patent JP4329938
Kind Code:
B2
Abstract:
A light emitting device fabrication method. The fabrication method of the light emitting device comprises providing a light emitting semiconductor device; positioning a plurality of luminescent particles at the optical path of the light emitting semiconductor device; and reducing the distance between the luminescent particles to enhance the molecular attraction between the luminescent particles, than the luminescent particles is coagulated to a luminescent powder layer by the molecular attraction.

Inventors:
Chung Cheng Yuan
Yuu Kure
Application Number:
JP2005042173A
Publication Date:
September 09, 2009
Filing Date:
February 18, 2005
Export Citation:
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Assignee:
Hiromoto Technology Co., Ltd.
International Classes:
H01J1/62; H01L23/02; H01L33/50
Domestic Patent References:
JP2000150966A
JP2001111109A
JP64005079A
JP61131860U
JP11040858A
JP2003069086A
JP2003298116A
JP2003526212A
JP2003115614A
Attorney, Agent or Firm:
Sota Asahina
Fumio Akiyama



 
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