Title:
LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2017045902
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To enhance the reliability of a light-emitting device having a semiconductor light-emitting element.SOLUTION: A light-emitting device 100 includes a semiconductor light-emitting element 10 having a light emission surface 14, and a resin composition covering at least a part of the light emission surface 14. The resin composition contains an amorphous total fluorinated resin having only a saturated bond, and fluororesin having an adhesion group. The content of adhesion group of the resin composition may be 4×10-1×10wt%. The inclusion molar fraction of fluororesin having an adhesion group of the resin composition may be 0.1-20 mol%.SELECTED DRAWING: Figure 1
Inventors:
NIIZEKI SHOICHI
YAMADA KIHO
YAMADA KIHO
Application Number:
JP2015168302A
Publication Date:
March 02, 2017
Filing Date:
August 27, 2015
Export Citation:
Assignee:
NIKKISO CO LTD
International Classes:
H01L33/56
Domestic Patent References:
| JP2006131845A | 2006-05-25 |
Foreign References:
| WO2014178288A1 | 2014-11-06 | |||
| WO2007145181A1 | 2007-12-21 | |||
| WO2015037608A1 | 2015-03-19 | |||
| US20060138443A1 | 2006-06-29 |
Attorney, Agent or Firm:
Sakaki Morishita
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