To reduce misjudgment by an inspection device when an error of about 100 μm or more in the X, Y directions is generated in the inspection device, which is a conventional problem, for inspecting electric characteristic of an IC by using a printed conductive sheet, a conductive substrate or the like.

A method is provided, wherein, in order to bring a force line and a sense line which are conductive patterns of the printed conductive sheet, the conductive substrate or the like simultaneously into contact with a lead of an IC, each one line is branched into plural lines at the contact part of the lead, and the force line and the sense line are designed alternately and brought into contact with the lead. Hereby, even if the error of about 100 μm or more in the X, Y directions is generated in the inspection device, which is a problem in a conventional method, the contact with the lead is secured, to thereby reduce misjudgment by the inspection device.