Title:
ＭＣＰアセンブリおよび荷電粒子検出器
Document Type and Number:
Japanese Patent JP7081995
Kind Code:
B2
Abstract:
An MCP assembly of this embodiment is provided with an MCP unit and a flexible sheet electrode having a structure for facilitating handling thereof as a single body. The flexible sheet electrode is constituted by a mesh area provided with plural openings and a deformation suppressing portion surrounding the mesh area. Both the mesh area and the deformation suppressing portion are comprised of the same conductive material, and physical strength of the deformation suppressing portion is higher than that of the mesh area. With this configuration, the physical strength of an entire flexible sheet electrode is secured even if an opening ratio of the mesh area is increased, so that the handling of the flexible sheet electrode as a single body is facilitated.
Inventors:
Masahiro Hayashi
Application Number:
JP2018118992A
Publication Date:
June 07, 2022
Filing Date:
June 22, 2018
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
H01J43/06; H01J43/24; H01J43/28
Domestic Patent References:
| JP2017037782A | ||||
| JP2014078388A | ||||
| JP57196466A | ||||
| JP2011119279A | ||||
| JP2005538346A | ||||
| JP2006185828A | ||||
| JP2007057432A |
Foreign References:
| US20080290267 | ||||
| US20050258356 | ||||
| US7564043 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Yoshiki Kuroki
Kenichi Shibayama