Title:
MEMSデバイス
Document Type and Number:
Japanese Patent JP5050022
Kind Code:
B2
Abstract:
According to one embodiment, a MEMS device includes an electrode on a substrate, a movable structure which is supported in midair above the electrode by first and second anchor portions on the substrate, and moves toward the electrode, a first spring structure which connects the first anchor portion to the movable structure and uses a ductile material, and a second spring structure which connects the second anchor portion to the movable structure and uses a brittle material.
Inventors:
Tamio Ikehashi
Yasushi Tomizawa
Katsura Masunishi
Tomohiro Saito
Yasushi Tomizawa
Katsura Masunishi
Tomohiro Saito
Application Number:
JP2009214807A
Publication Date:
October 17, 2012
Filing Date:
September 16, 2009
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01G5/16; B81B3/00; H01H59/00
Domestic Patent References:
| JP2009105031A | ||||
| JP2003270555A | ||||
| JP2004181552A | ||||
| JP2004004119A |
Foreign References:
| WO2005059933A1 |
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen