Title:
MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
Japanese Patent JP2017007079
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a MEMS package structure having more excellent moisture resistance characteristic and a method for manufacturing the package structure.SOLUTION: A MEMS package structure includes a base, an MEMS device, a first cover, a second cover, and a glass frit. The base includes a recess. The MEMS device is located in the recess. The first cover is located in the recess, and covers the MEMS device. The second cover is located on the base, and covers the recess. The glass frit is located between the base and the second cover. The MEMS package structure includes a base, a MEMS device, a first cover, a second cover, a first metal frame, and a first encapsulation material. The first metal frame is located on a periphery of the second cover, the second cover and the first metal frame are located on the base altogether and covers the recess. The first encapsulation material is located between the first metal frame and the base. Further, a method for manufacturing the above-said MEMS package structure is provided.SELECTED DRAWING: Figure 1d
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Inventors:
WU TUNG-FENG
CHEN WEI-HSIAO
SU CHUN-HAO
CHEN JUI-WEN
CHENG MAO-CHIEN
CHEN WEI-HSIAO
SU CHUN-HAO
CHEN JUI-WEN
CHENG MAO-CHIEN
Application Number:
JP2015225735A
Publication Date:
January 12, 2017
Filing Date:
November 18, 2015
Export Citation:
Assignee:
HIMAX DISPLAY INC
International Classes:
B81B7/02; B81C3/00
Domestic Patent References:
| JP2008166837A | 2008-07-17 | |||
| JP2014231122A | 2014-12-11 | |||
| JP2010012595A | 2010-01-21 | |||
| JP2009178778A | 2009-08-13 | |||
| JP2006300976A | 2006-11-02 |
Attorney, Agent or Firm:
Koichi Washida