マレイミド化合物及びその製造方法、アミド酸化合物及びその製造方法、樹脂組成物、硬化物、樹脂シート、プリプレグ、金属箔張積層板、プリント配線板、封止用材料、繊維強化複合材料、接着剤、並びに半導体装置

Title:

Document Type and Number:

Japanese Patent JP7365574

Kind Code:

B2

Abstract:

To provide a maleimide compound that expresses excellent adhesiveness to a chip, a substrate or the like, and a method of producing the same.SOLUTION: The present invention relates to a maleimide compound represented by the formula (1) (where, R1 independently represent a hydrogen atom, a C1-6 linear or branched alkyl group, a halogen atom, a hydroxy group, or a C1-6 linear or branched alkoxy group, R2 is a hydrogen atom, or a C1-6 linear or branched alkyl group, R3 and R4 independently represent a hydrogen atom, a halogen atom, a C1-6 linear or branched alkyl group, or a C1-6 linear or branched alkenyl group. n is an integer of 1-30 and m independently represent an integer of 1-4).SELECTED DRAWING: None

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Inventors:

Shunsuke Katagiri
Takuya Suzuki
Seiji Shike
Yune Kumazawa

Application Number:

JP2019139213A

Publication Date:

October 20, 2023

Filing Date:

July 29, 2019

Export Citation:

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Assignee:

Mitsubishi Gas Chemical Co., Ltd.

International Classes:

C08G73/02; C08F22/40; C08F299/02; C08J5/24; C09J4/00; H05K1/03

Domestic Patent References:

JP2019089929A
JP2018168085A
JP2018028105A
JP2017149859A
JP2017179310A
JP3223249A
JP62065710A
JP2018083905A
JP9110965A

Attorney, Agent or Firm:

Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito

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