Title:
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2022122542
Kind Code:
A
Abstract:
To provide a maleimide resin composition that can achieve even lower dielectric loss tangent in a high frequency band of 10 GHz band or higher, and to provide a prepreg, a resin film, a laminate, a multilayer printed wiring board and a semiconductor package using the maleimide resin composition.SOLUTION: Provided is a maleimide resin composition that contains (A) one or more selected from the group consisting of maleimide compounds having one or more N-substituted maleimide group and derivatives thereof, (B) a thermoplastic elastomer, and (C) a divinyl compound.SELECTED DRAWING: None
Inventors:
SUZUKI TAKAYUKI
KOTAKE TOMOHIKO
KOTAKE TOMOHIKO
Application Number:
JP2021019847A
Publication Date:
August 23, 2022
Filing Date:
February 10, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
C08F287/00; C08F2/44; C08J5/24; H05K1/03
Attorney, Agent or Firm:
Otani patent office
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