Title:
マレイミド樹脂、硬化性樹脂組成物およびその硬化物
Document Type and Number:
Japanese Patent JP6836621
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide: a maleimide resin which has a specific structure that brings about excellent heat resistance and excellent low-dielectric characteristics and which is suitable for use in encapsulating electrical/electronic components or in circuit boards, carbon fiber composite materials, etc.; a curable resin composition; and a cured object obtained therefrom. The maleimide resin is represented by formula (1). In formula (1), R represents a hydrocarbon group having 1-18 carbon atoms. m is an integer of 1-4 and n is an average value satisfying 1≤n≤20.
Inventors:
Takashima Toshima
Atsuhiko Hasegawa
Atsuhiko Hasegawa
Application Number:
JP2019078503A
Publication Date:
March 03, 2021
Filing Date:
April 17, 2019
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08G14/02; C07D207/448; C08F22/40; C08G59/42
Domestic Patent References:
| JP3190914A | ||||
| JP2009149729A | ||||
| JP2008208201A | ||||
| JP2003146970A | ||||
| JP2003055342A | ||||
| JP3100016A |
Foreign References:
| WO2017170551A1 | ||||
| WO2016117584A1 |