To provide a management method of a cutting blade for cutting a wafer in a desired cutting depth even if a temperature of cutting water and a room temperature are changed.

The management method of a cutting blade 50 in a cutting machine is provided. The cutting machine is provided with: a chucking table, a cutting means for cutting a wafer; a cutting water supplying means; a blade detecting means 68 for detecting wear of a cutting edge; and a reference position detecting means of the cutting blade 50. The method has a temperature detecting step of detecting a cutting water temperature and a room temperature where the cutting machine is installed; the reference position detecting step of detecting a reference position of cutting edge 50a of the cutting blade 50; a reference position correcting step of detecting a wear amount of the cutting blade 50, finding a difference between the reference position of the cutting edge 50a and that of the cutting blade 50, and correcting the reference position of the cutting edge 50a; and a resetting step of always carrying out the temperature detecting step, and carrying out the reference position detecting step again when detecting a cutting water temperature different from the cutting water temperature by a first predetermined value or more, or when detecting a room temperature different from the room temperature by a second predetermined value or more.

COPYRIGHT: (C)2010,JPO&INPIT