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Title:
MANDREL, AND ORIFICE PLATE FOR ELECTROFORMING USING THE MANDREL
Document Type and Number:
Japanese Patent JP3851789
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a mandrel capable of electroforming an orifice plate with non-uniform thickness, and a method therefor.
SOLUTION: This orifice plate has a thick boundary 32 surrounding a thin orifice area 34. The mandrel has a metal layer 4 on a substrate 6. The metal layer 4 has a first electroformed surface 18 which is electrically insulated from a second electroformed surface 19. The boundary 32 and the orifice area 34 are substantially electroformed on the first and second electroformed surfaces 18 and 19. The mandrel 2 has a patterned insulation layer 8 on the metal layer 4 for electroforming an orifice 30 in the orifice area 34. In the electroforming process, the first electroformed surface 18 is used for electroforming the boundary 32 while the orifice area 34 is not electroformed. When the metal is deposited on the boundary 32, the first electroformed surface 18 and the second electroformed surface 19 are electrically connected to each other, and successively, the orifice area 34 is electroformed on the second electroformed surface 19.


Inventors:
Banchai Tee
Application Number:
JP2001231402A
Publication Date:
November 29, 2006
Filing Date:
July 31, 2001
Export Citation:
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Assignee:
HEWLETT-PACKARD COMPANY
International Classes:
B41J2/135; B41J2/14; C25D1/10; B41J2/16; C25D1/08; (IPC1-7): C25D1/10; B41J2/135; C25D1/08
Domestic Patent References:
JP5261931A
JP5286141A
JP2000313984A
JP10008288A
Attorney, Agent or Firm:
Masaki Goto
Yoshio Matsuda