To provide a manufacturing method of a high-density and high-function build-up type of multilayer printed wiring board.
This manufacturing method includes a process of forming a resin layer 104 to constitute an insulating layer on the wiring board 101 having a pillar-shaped conductor 103 to perform interlayer connection on a lower wiring 102 and drying it, and putting a copper foil 105 on the resin layer 104, and welding a copper coil 105 to the resin layer 104 by hot press method to perform hot press, and applying etching processing to the welded copper foil 105 to form an upper wiring 115. In this case, the copper foil on the head of the pillar- shaped conductor 103 welded by hot press is removed once, and then an interlayer connection 111 is made by the interlayer connection method to connect the pillar-shaped conductor 103 and the copper foil again, by plate treatment.
KARASUNO YUTAKA
TAKAHASHI YOSHIRO
