Title:
MANUFACTURE OF CERAMIC LAMINATED BOARD
Document Type and Number:
Japanese Patent JP3186355
Kind Code:
B2
Abstract:
PURPOSE: To provide a method wherein a wiring pattern having a fine line can be formed easily and surely and a ceramic wiring board can be manufac tured at low cost.
CONSTITUTION: The manufacturing method of a ceramic multilayer board is provided with individual processes such as a process in which a wiring pattern 6 formed by a thin-film formation method by photolithography is formed on a support film, a process in which the wiring pattern 6 is thermally transferred to a ceramic green sheet 2 in which via holes 3 have been formed, a process in which a conductive material is formed in the via holes 3 in the ceramic green sheet and a process in which via-hole electrodes 3A are formed.
Inventors:
Bandai Harufumi
Norio Nakashima
Masato Uto
Norio Nakashima
Masato Uto
Application Number:
JP18521293A
Publication Date:
July 11, 2001
Filing Date:
July 27, 1993
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/20; H05K3/40; H05K3/46; H05K1/03; (IPC1-7): H05K3/46
Domestic Patent References:
| JP242797A | ||||
| JP697658A | ||||
| JP56155587A | ||||
| JP62172796A |
Attorney, Agent or Firm:
Contents Makoto (1 person outside)