Title:
MANUFACTURE OF CERAMIC MULTILAYER BOARD
Document Type and Number:
Japanese Patent JP3266986
Kind Code:
B2
Abstract:
PURPOSE: To improve manufacturing properties and to reduce a cost of a ceramic multilayer board by simplifying manufacturing steps in a method for manufacturing the board having through holes.
CONSTITUTION: The method for manufacturing a ceramic multilayer board comprises the steps of so forming through holes 2a-2d of a predetermined width intermittently continued along a shape of through holes to be formed at the board after baking at flat surfacelike green sheets that, when a plurality of the sheets 1a-1f are laminated, discontinued parts 3a-3d of the holes 2a 2d are not brought into contact with each other, laminating them, compression bonding them and removing, after baking, the parts to serve as the holes.
Inventors:
Shigetoshi Segawa
Yasuyuki Baba
Kenji Nakayama
Yasuyuki Baba
Kenji Nakayama
Application Number:
JP14351693A
Publication Date:
March 18, 2002
Filing Date:
June 15, 1993
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/00; H05K3/46; (IPC1-7): H05K3/46; H05K3/00
Domestic Patent References:
| JP433397A | ||||
| JP4288854A | ||||
| JP2238642A | ||||
| JP3274108A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)