Title:
MANUFACTURE OF CERAMIC PACKAGE
Document Type and Number:
Japanese Patent JP3222348
Kind Code:
B2
Abstract:
PURPOSE: To reduce the warp of a package base body when a heat spreader is brazed to the rear of the package base body comprising a recessed part on which an electronic component is to be mounted by a method wherein a copper plate is used as the heat spreader and a brazing temperature is specified.
CONSTITUTION: A package base body 1 comprises a chip mounting part 4 composed of a cavity (a recessed part) on which a semiconductor chip 3 is to be mounted in the central part, and a plurality of external terminals 5 are erected and installed around a face on the side on which the chip mounting part 4 has been formed. A heat spreader 2 which is fixed and bonded to the rear 1a of the package base body 1 is formed of a copper plate, and an Ni-plated layer 9 is formed on the whole face of the heat spreader 2. The package base body 1 and the heat spreader 2 are fixed and bonded by a silver brazing material 10. At this time, a brazing operation is performed at a temperature within a range of the melting point of the brazing material to the melting poing plus 20°C while a load at 7.6g/cm2 or higher is being applied to the heat dissipating face of the heat spreader.
Inventors:
Keiji Narishige
Application Number:
JP7056595A
Publication Date:
October 29, 2001
Filing Date:
March 03, 1995
Export Citation:
Assignee:
Sumitomo Metal Electro Device Co., Ltd.
International Classes:
H01L23/373; H01L23/40; (IPC1-7): H01L23/40; H01L23/373
Domestic Patent References:
| JP2208031A | ||||
| JP831980A | ||||
| JP2187058A | ||||
| JP697671B2 |
Attorney, Agent or Firm:
Fujio Nakamae