Title:
MANUFACTURE OF CONTACT PIN FOR INSPECTING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3239937
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a contact pin which is highly flexible with a higher electric conductivity to allow adaptation to even a fine wired pad used in electrical inspection of a high-density printed wiring board.
SOLUTION: In the method, there are implemented a process wherein a photosensitive resin layer 4 is formed on a wiring board 3 with an electrode pad 2 to form a pattern by a method of photochemical reaction, a process wherein a solution that allows formation of a molding of an electroconductive high polymer is subsequentially introduced to form the molding of the electroconductive high polymer at an opening part 5 of the photosensitive resin 4 and a process of removing the photosensitive resin layer 4. This enables manufacturing of a contact pin which is highly flexible with a higher electric conductivity.
Inventors:
Masaharu Sato
Yousuke Itagaki
Daisaku Nakata
Hajime Kusumi
Yousuke Itagaki
Daisaku Nakata
Hajime Kusumi
Application Number:
JP13671898A
Publication Date:
December 17, 2001
Filing Date:
May 19, 1998
Export Citation:
Assignee:
NEC
International Classes:
G01R1/073; G01R3/00; H05K3/00; (IPC1-7): G01R1/073
Domestic Patent References:
| JP7235739A | ||||
| JP5281259A |
Attorney, Agent or Firm:
Johei Yamashita
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