Title:
MANUFACTURE OF COPPER-CLAD LAMINATE
Document Type and Number:
Japanese Patent JPH06106645
Kind Code:
A
Abstract:
PURPOSE: To provide a method for manufacturing a copper-clad laminate where dimensional change and dispersion at processing a circuit are slight.
CONSTITUTION: A copper-clad laminate can be obtained by superposing a copper foil on a plurality of prepregs obtained by making base materials such as glass woven fabric and glass un-woven fabric impregnated with resin, and pressurizing it with heat. The obtained copper-clad laminate is vibrated and further heated. The heating temperature is made to be above glass transition temperature of the using resin and below molding temperature +20°C. It is desirable to give vibration also during cooling process.
Inventors:
SHIMIZU HIROSHI
Application Number:
JP26144992A
Publication Date:
April 19, 1994
Filing Date:
September 30, 1992
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B29C71/00; B29C43/02; B29C71/02; B32B15/08; B32B17/04; B32B37/00; H05K3/00; B29K105/06; (IPC1-7): B29D9/00; B29C71/00; B29C71/02; B32B15/08; B32B17/04; B32B31/16; H05K3/00
Attorney, Agent or Firm:
Kunihiko Wakabayashi