PURPOSE: To improve reliability by preventing generation of voids between an internal electrode and a ceramic layer and within the internal electrode itself and also eliminating structural defects such as chip deformation due to bending of the internal electrode and electrode breakage.

CONSTITUTION: A copper paste 2 prepared by adding such additives as organic vehicle and solvent to a specified sized copper powder to attain a specified inclusion ratio is coated on a ceramic green sheet 1 to attain a film thickness of 1-3μm. And then, a plurality of ceramic sheets are laminated and baked. For preparing a copper paste, additives such as organic vehicle and solvent are added to the copper powder of average grain size of 0.5-2μm and grain size range 0.3-4μm for attaining inclusion ratio of 40-60w.