Title:
MANUFACTURE OF DOUBLE-SIDED WIRING BOARD
Document Type and Number:
Japanese Patent JP2000101244
Kind Code:
A
Abstract:
To provide a method for manufacturing a double-sided multilayer wiring board by which multilayer conductive layers can be formed without generating haloing and insulating resin can be applied in via holes without generating air bubbles, to improve reliability of connecting parts and to realize high-density wiring.
A board 20 has conductive layers at least on both sides. At least one via hole 26 is formed on an insulating layer 24 provided on one side of the board 20. After that, when the insulating layer 24 is hardened by heat, oxide layers 28 are generated on the exposed surface of the conductive layers on the board. At least one oxide layer 28 on the other side of the board 20 is reduced to manufacture a double-sided wiring board 42.
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Inventors:
KASE TAKAYUKI
YABUUCHI TSUNEO
YABUUCHI TSUNEO
Application Number:
JP26412498A
Publication Date:
April 07, 2000
Filing Date:
September 18, 1998
Export Citation:
Assignee:
IBM
International Classes:
H05K3/38; H05K3/42; H05K3/44; H05K3/46; H05K1/05; H05K3/00; (IPC1-7): H05K3/46; H05K3/38
Attorney, Agent or Firm:
Hiroshi Sakaguchi (2 outside)
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