Title:
MANUFACTURE OF ELECTRIC CIRCUIT SUPPORT
Document Type and Number:
Japanese Patent JPS62112395
Kind Code:
A
Abstract:
In a method of manufacturing supports for electrical circuits, a conductive coating is applied to both sides of a board. Holes are drilled in the coated board. A discontinuity is produced in the electrical conductivity around at least some of these holes on at least one side of the board to prevent electrolytic deposition on the walls of these holes. A conductive material is then deposited at predetermined positions by electrolysis. After both sides of the board and the walls of the holes have been coated with the conductive material, the aforementioned discontinuity in the electrical conductivity around some of the holes on at least one side of the board is obtained by removing this conductive material in localized areas around the holes concerned.
Inventors:
KUROODO JIYAN SHIYARURU JIYUUR
Application Number:
JP21733786A
Publication Date:
May 23, 1987
Filing Date:
September 17, 1986
Export Citation:
Assignee:
ETUD E DASHISUTANSU TECHNIC SO
International Classes:
H05K1/11; H05K3/00; H05K3/04; H05K3/06; H05K3/10; H05K3/42; (IPC1-7): H05K3/00
Attorney, Agent or Firm:
Aoki Akira