PURPOSE: To realize a high density connection between electric circuit members by forming a plurality of holes having an uniform form in a photosensitive resin and manufacturing an electric connecting member such that the forms of all conductive members are uniform.
CONSTITUTION: A polyimide resin 2 is applied onto a copper plate 1, and a light is radiated through a photo-mask 3 having a determined pattern to expose the polyimide resin 2. The polyimide resin 2 is developed with a developing solution to form holes 4, and an intermediate product 10 is then left as it is for a determined time in heating atmosphere and/or negative pressure atmosphere so as to evaporate the developing solution soaked in the polyimide resin 2 and make the holes 4 having an uniform form. Recessed parts 5 communicating with the holes 4 are formed, and gold 6 is plated and charged in the holes 4 and the recessed parts 5, and the copper plate 1 is then removed.
YOSHIZAWA TETSUO
MIYAZAKI TOYOHIDE
KONDO HIROSHI
TERAYAMA YOSHIMI
TAMURA YOICHI
OKABAYASHI TAKAHIRO
KONDO KAZUO
NAKATSUKA YASUO
IKEGAMI YUICHI
SUMITOMO METAL IND