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Title:
MANUFACTURE OF ELECTROMAGNETIC WAVE SHIELDING RESIN LAMINATED BOARD
Document Type and Number:
Japanese Patent JPS6219435
Kind Code:
A
Abstract:

PURPOSE: To provide a plastic electromagnetic wave shielding body with no separation of electroconductive powder by a method wherein prepreg which is obtained by drying reinforcing material impregnated with thermosetting resin varnish, and the laminate of prepreg, onto the surface of which electroconductive powder containing thermosetting resin varnish is applied and dried, are put one upon the other and the resultant piled-up prepregs are pressed and cured by heating.

CONSTITUTION: A laminated board is obtained by putting normal prepreg which is obtained by drying reinforcing material applied and impregnated with resin varnish, and laminate of prepreg onto the surface of which electroconductive powder containing resin varnish is applied and dried, one upon the other; and, after that, by heating and forming with a press at 100W250°C to cure the thermosetting resin. Silver, gold or the like, the particle diameter of which is 100μm or less, is used as the electroconductive powder. Hardener containing thermosetting resin such as melamine resin or the like is employed as the resin binder in which the electroconductive powder is dispersed. Linter paper, kraft paper or the like is used as the reinforcing base material. The prepreg is obtained by drying said base material containing the electronconductive powder impregnated with resin varnish.


Inventors:
OGI YASUYUKI
Application Number:
JP15923585A
Publication Date:
January 28, 1987
Filing Date:
July 18, 1985
Export Citation:
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Assignee:
YUKA MELAMIN
International Classes:
H01B5/14; B32B15/08; B32B37/00; C08J5/24; H01B5/00; H05K9/00; B29K105/06; (IPC1-7): B29D9/00; B29K105/06; C08J5/24; H01B5/14; H05K9/00
Attorney, Agent or Firm:
Takaya Yamamoto