To bond a radiator on the peripheral surface of an electron tube main body firmly.
On the peripheral surface of an electron tube main body 12, a radiator 14 is bonded and fixed by a soldering. A manufacturing device 21 furnishes a holding mechanism 22, heating mechanism 23, a cooling mechanism 24, and a temperature measuring mechanism. In the bonding work, the electron tube main body 12 is installed to the holding mechanism 22 at first, the radiator 14 is abutted on the peripheral surface of the electron tube main body 11 through the solder, and they are held by a fastening jig 28. After that, while the holding mechanism is driven to rotate, a hot blast is outputted from the heating mechanism 23 to heat the solder. The temperature is measured by the above temperature measuring mechanism, and when the temperature is at the value that melts the solder, the heating mechanism 23 is stopped while the holding mechanism 22 is being driven to rotate, and the cooling mechanism 24 is operated.
NAGAYAMA AKIHIKO
ONUKI HIROBUMI
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