Title:
MANUFACTURE OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JPS5591836
Kind Code:
A
Abstract:
PURPOSE:To eliminate the formation of step in level between surfaces of an electronic part and a substrate, by placing a substrate-making dielectric material into a mold in such a position as to cover surrounding of an electric part placed in the forming mold keeping the electrode with its surface on the bottom side and hardening it by applying pressure or heat. CONSTITUTION:In a cavity 5a of a bottom mold 5 for forming a dielectiric substrate 2, a semiconductor element 1 is placed by keeping its electrode 1a dwnward, and by applying pressure and heat onto the top by a plunger 6a of a top mold 6, a product is obtained. The dielectric materials 2a are to consist of phenol, diallylphthalate and ceramic, etc., and the preformed materials may be used. Since it is possible in this manner to proceed with forming operation while keeping the semiconductor element 1's electrode 1a pressed against a flat surface in the cavity 5a of the bottom mold 5, the semiconductor element 1 can be formed keeping surfaces of the electrode 1a and the substrate 2 on the same level, and therefore, breakage in wiring works to be done later can be eliminated.
Inventors:
UMETSU MASAMI
Application Number:
JP16397578A
Publication Date:
July 11, 1980
Filing Date:
December 29, 1978
Export Citation:
Assignee:
SUWA SEIKOSHA KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60