Title:
MANUFACTURE OF FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3187789
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method by which a flexible printed circuit board can be manufactured by not using separate facilities, but already existing hard printed circuit board manufacturing facilities.
SOLUTION: A method for manufacturing flexible printed circuit board is constituted of a laminating process in which a non-adhesive member 200 and raw material sheets 100a and 100b for flexible printed circuit board are successively laminated upon one or both of the upper and lower surfaces of an adhesive member, and the member 300 is stuck to the edge sections of the sheets 100a and 100b; an external size working process in which both edge sections of the sheets 100a and 100b are cut off; a hole forming process in which holes for forming circuits are bored; a printed circuit board manufacturing process in which a printed circuit board is manufactured by using hard printed circuit board manufacturing facilities; and a board separating process in which the manufacture of a flexible printed circuit board is terminated by separating the raw material sheets 100a and 100b from the adhesive member 300.
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Inventors:
Reason Nguye
Kim Hyun Kung
Kim Hyun Kung
Application Number:
JP17796099A
Publication Date:
July 11, 2001
Filing Date:
June 24, 1999
Export Citation:
Assignee:
LG Electronics Co., Ltd.
International Classes:
H05K3/46; H05K3/00; H05K1/00; H05K3/06; (IPC1-7): H05K3/00
Domestic Patent References:
| JP5218616A | ||||
| JP61183998A |
Attorney, Agent or Firm:
Takashi Ishida (4 others)