PURPOSE: To form a chip fuse integrally with a chip diode by a method wherein a soldering is performed in the order of the end part of a lead frame on one side, the chip diode, the chip fuse and the end part of a lead frame on the other side and they are molded with an epoxy resin.

CONSTITUTION: A chip diode 14 and a chip fuse 15 are respectively placed in each slot 23a to correspond to the end parts 11a and 12a of lead frames 11 and 12 provided on a second jig 23 through each solder pellet 13. Copper plates 16 are respectively inserted in each slot 23a from over the diode 14 and the fuse 15 and a third jig 24 made of carbon is placed. The whole is put in a heating furnace and is subjected to heating treatment. Whereupon, a soldering is performed between the end parts 11a and 12b in the order of the diode 14, the copper plates 16 and the fuse 15. After a resin molding is performed with an epoxy resin, the frames 11 and 12 are cut off from a runner. Thereby, the fuse 15 is formed integrally with the diode 14.