PURPOSE: To enable uniform perforation of solid portions of an image when a stencil paper is manufactured and to obtain a high quality printed matter with an excellent resolution, by bonding an ink permeating substrate and a thermoplastic film, using a special heat resistant adhesive.

CONSTITUTION: When a heat sensitive stencil paper is manufactured by bonding an ink permeating substrate and a thermoplastic film together, a heat resistant adhesive used has a viscosity of 300 centipoise or higher, and a thermoplastic film used should not substantially soften or melt at a temperature a at which the paper is perforated. After the heat resistant adhesive is applied to the ink permeating substrate, the thermoplastic film is bonded thereabove. The ink permeating substrate is be made of a paper, a unwoven fabric, a screen or a plastic film which is already perforated by some method and which is made of a natural and/or synthetic fiber that are (is) not affected at the temperature at which the thermoplastic film is perforated. The heat resistant adhesive used should be a thermosetting adhesive or moisture curing adhesive, etc.