Title:
MANUFACTURE OF HEAT STABILIZING STRUCTURED LAYER
Document Type and Number:
Japanese Patent JPS6389846
Kind Code:
A
Abstract:
Heat-resistant structured layers can be produced by applying radiation-sensitive soluble polymers in the form of a layer or film to a substrate, irradiating the layer or film through negative masters with actinic light or by guiding a light, electron, laser or ion beam, removing the unirradiated layer or film parts and, optionally, by subsequent heat treatment. Production is inexpensive, dimensionally accurate and of high quality, and in particular takes place in a single coating operation, if photopolymers in the form of addition products of olefinically unsaturated monoisocyanates with phenol formaldehyde resins are used. The layers produced by this process withstand even the thermal and mechanical stresses of dipped soldering processes and effectively protect circuit surfaces permanently against moisture and corrosion; they are suitable, in particular, as solder resist and insulating layers in fine-conductor technology.
Inventors:
HERUMUUTO AANE
UINFURIITO PURUNDORITSUHI
UINFURIITO PURUNDORITSUHI
Application Number:
JP22383687A
Publication Date:
April 20, 1988
Filing Date:
September 07, 1987
Export Citation:
Assignee:
SIEMENS AG
International Classes:
C08J3/28; G03F7/032; G03F7/038; G03F7/38; B32B27/42; (IPC1-7): B32B27/42; C08J3/28; G03C1/68; G03C1/71; G03C5/00; G03F7/00
Attorney, Agent or Firm:
Tomimura Kiyoshi