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Title:
MANUFACTURE OF HEAT TRANSFER SURFACE BOILING AT LOW DEGREE OF SUPERHEAT
Document Type and Number:
Japanese Patent JPS5956697
Kind Code:
A
Abstract:

PURPOSE: To enable to obtain a heat transfer surface having a shape nearly as intended, by thickly plating a metallic surface together with a linear masking being provided on it, and by removing the masking material from the surface by a thermal or a chemical method, afterward.

CONSTITUTION: When a metallic surface masked with a wire rod material of non-conductivity having some width and thickness, is plated, a plated material grows to the horizontal direction as well as to the direction of thickness, so that the wire rod material is gradually buried and is completely buried after all into the plated material regardless of the sectional form of a wire rod material. If a plating operation is stopped a little before the wire rod material is completely buried, grooves having both open parts along the wire rod material which is narrower in width than the wire rod material itself, and closed parts, being mixed with each other, are formed on the surface of a masking wire. By removing the inside wire rod material from the open part of the groove, a heat transfer surface of which shape is nearly as required can easily be obtained.


Inventors:
OOUCHI MASAKI
ABE TOSHIHIKO
YONETANI MICHIO
Application Number:
JP7629382A
Publication Date:
April 02, 1984
Filing Date:
May 06, 1982
Export Citation:
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Assignee:
KOGYO GIJUTSUIN
International Classes:
F28F13/02; B01B1/00; F28F13/18; (IPC1-7): B01B1/00; F28F13/02
Domestic Patent References:
JPS5616693A1981-02-17
Attorney, Agent or Firm:
Director, Tohoku Institute of Industrial Technology, Institute of Industrial Technology



 
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