Title:
MANUFACTURE OF HYBRID INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPS5737839
Kind Code:
A
Abstract:
PURPOSE:To prevent the generation of defective products resulting from the pressed out bonding agnent when a pellet bonding work is performed by a method wherein a bonding agent is printed on the pellet in such a manner that the four corners will be coincided with the square-shaped pellet and the side sections are formed into concaved shape. CONSTITUTION:On the surface of the ceramic substrate 1 whereon a thin film capacitor 2, a thin film resistor 3, a conductive layer 4 and the like are formed, the bonding agent 5 is printed and the pellet 7 is bonded and fixed on the printed surface 5. This printed surface is formed in such a manner that the four corners are protruded so as to coincide with the corners of the pellet and that the side sections are formed into concaved shapes 11-13. Through these procedures, the pressing out of the bonding agent can be prevented even when the pellet is vibrated while a bonding work is performed, thereby enabling to improve adhessiveness as well as to prevent the generation of defective products resulting from the short-circuit and the like of the conductive layer 4.
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Inventors:
OOTANI MASAHIRO
Application Number:
JP11318080A
Publication Date:
March 02, 1982
Filing Date:
August 18, 1980
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/52; H01L21/58; (IPC1-7): H01L21/58