PURPOSE: To improve dimensional and shape accuracies of a hybrid integrated circuit by soldering components, preparing a both-side pectinated terminal having a clip structure with an elastic material as a blank, connecting the ends while applying pressures from both sides with a substrate terminal, and cutting the center part.

CONSTITUTION: A terminal connecting portion 3a is positioned at a terminal on a circuit board to be connected. The portion 3a is pressed from both sides of the terminal 3 by a jig 5 to closely contact with the surface of the board in the step of connecting the terminal 3 with the board 1, and simultaneously fixed by a method after thermal press-bonding and brazing steps. At this time, since the terminal 3 is corrected at the portion 3a in a direction reverse to the bending direction, the upper half is applied by a force in a direction to draw a circle to the outside and the lower half is applied by a force in a direction to draw a circle to the inside by the elasticity of the terminal 3 to hold the elastically deformed states. The upper and lower halves of the terminal are eliminated at the deformations by cutting together with a bridge 3d to obtain a desired shape.