To provide a method for manufacturing an IC package for ensuring strength at dicing, and for preventing an adhesive from being left at an outside terminal.

Plural IC chips 20 are loaded on a surface 12 of a print board 10 having an outside terminal 15 on the back face, and the plural IC chips 20 are sealed by a common resin package 30, and the common resin package 30 is cut and divided into plural individual IC packages in this method for manufacturing an IC package. In this case, a common first adhesive tape 51 is adhered to the surface of the common resin package 30 which is faced downward. In this state, the print board 10 and the common resin package 30 are cut with the first adhesive tape 51 left, and plural individual IC packages 30A and 30B can be formed. Then, a common second adhesive tape 52 is adhered to the outside terminals of the plural cut individual IC packages. Finally, the whole part is rotated so that the adhesive tape 52 can be faced downward, and the first adhesive tape 51 faced upward is peeled off.