PURPOSE: To avoid delamination and cracks produced at the time of removing binder and remove the binder uniformly and in a short time by a method wherein chips are heated in vacuum and pressure is applied to the chip from all the directions in the air.

CONSTITUTION: Green chips 1 are arranged on a polyamide system heat-resistant film 2a and a sealant tape 3 is applied to the heat-resistant film 2a so as to surround the green chips 1. An exhaust duct 4 is placed so as to cross the sealant tape 3 and a sealant tape 3 is also applied to the upper surface of the exhaust duct 4 so as to provide air-tight sealing. A heat-resistant film 2b covers the whole surface and is tightly bonded to the sealant tape 3. Then the exhaust duct 4 is connected to a vacuum pump and, while the vacuum state about 10 - 20Torr is maintained, a thermal treatment under the temperature of 250 - 300°C is applied to decompose and evaporate binder. After the binder is decomposed, the whole assembly is put on a baking setter as it is and baked after the part to which the sealant tape 3 is applied is cut off. With this constitution, the binder can be removed in a short time and delamination and cracks can be avoided.