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Title:
MANUFACTURE OF LAMINATED TYPE CERAMIC CHIP CAPACITOR
Document Type and Number:
Japanese Patent JP3190177
Kind Code:
B2
Abstract:

PURPOSE: To thin a dielectric green sheet layer by a method wherein the dielectric green sheet layer and an inner electrode paste layer are formed alternately on a carrier film, two or more laminated bodies, having a plurality of dielectric green sheet layers, are laminated and they are fired.
CONSTITUTION: The laminated type ceramic chip capacitor 1 has a capacitor chip body 10 which constitutes a laminated body having a dielectric green sheet layer 2 of 2 to 50 layers formed by alternately laminating a dielectric green sheet layer 2 and an inner electrode paste layer 3, and the outermost layer in the direction of lamination forms a protective layer made of dielectric layer material. Two or more layers are laminated on the laminated body and they are fired. Besides, an external electrode 4, which is communicated to the inner electrode paste layer 3, is provided on the surface of the capacitor chip body 10. As a result, the dielectric green sheet layer 2 can be thinned and they can also be brought into a multilayer state.


Inventors:
Yukie Nakano
Tomohiro Arashi
You Sato
Takeshi Nomura
Application Number:
JP15435493A
Publication Date:
July 23, 2001
Filing Date:
June 01, 1993
Export Citation:
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Assignee:
TDK Co., Ltd.
International Classes:
H01G4/12; H01G4/30; (IPC1-7): H01G4/12; H01G4/30
Domestic Patent References:
JP6466916A
JP6465818A
JP590067A
JP163127U
Attorney, Agent or Firm:
Youichi Ishii