Title:
MANUFACTURE OF MOLDING MATERIAL FOR SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP2929896
Kind Code:
B2
Abstract:
PURPOSE: To manufacture a material for sealing a semiconductor having a high fluidity and sufficient characteristics for sealing the semiconductor by melting a resin component by pushing force from the outside and coating the surfaces of inorganic filler particles with the resin component and compounding the residue of the resin component and another compounding ingredient.
CONSTITUTION: When a molding material for sealing a semiconductor is manufactured, inorganic fillers are supplied with a part or all of a resin component while pushing force is applied from the outside and the resin component is melted, the surfaces of inorganic filler particles are coated with the resin component, and the residue of the resin component and another compounding ingredient are blended with the inorganic filler particles. The resin component for sealing the semiconductor is selected variously in response to the kind of a sealing resin, but an epoxy resin, a phenol resin, etc., can be used. Crystalline silica, molten silica, etc., can be cited as the inorganic fillers. Both of a crushed shape and a spherical shape can also be employed as the form of the inorganic fillers. A curing catalyst, a colorant, etc., are quoted as other compounding ingredients.
Inventors:
UENO SUSUMU
FUJIMURA YOSHIO
NISHIMINE MASAYUKI
FUJII SHUICHI
FUJIMURA YOSHIO
NISHIMINE MASAYUKI
FUJII SHUICHI
Application Number:
JP10731593A
Publication Date:
August 03, 1999
Filing Date:
April 09, 1993
Export Citation:
Assignee:
SHINETSU KAGAKU KOGYO KK
International Classes:
B29B7/00; B29B11/16; B29B15/10; B29C45/02; H01L21/56; B29K105/16; (IPC1-7): B29B11/16; B29B7/00; H01L21/56
Domestic Patent References:
| JP2166753A | ||||
| JP2153948A | ||||
| JP1139132A |
Attorney, Agent or Firm:
Takashi Kojima