PURPOSE: To efficiently manufacture a high-density multilayerd printed wiring board by preventing the flow out of a resin by blocking a hole with copper foil and forming necessary connection with inner layers by plating before forming a laminated layer.
CONSTITUTION: After forming a bonding agent layer of an epoxy resin on the surface of the insulating material of a laminated board having the insulating material on at least on surface, the bonding agent layer is dried and a hole is bored in the laminated board through the material with a drilling machine. Then copper foil is stuck to the surface of the laminated body with the bonding agent. Thereafter, electroless copper plating and electroplating are successively performed on the internal surface of the hole. Since the hole is only formed at a location to be connected and the flowing out of a resin is prevented by the copper foil, a high-density multilayer printed wiring board can be efficiently manufactured.
TSUYAMA KOICHI
KIDA AKINARI
URASAKI NAOYUKI
Next Patent: MANUFACTURE OF LAMINATED BODY FOR MULTILAYER PRINTED WIRING BOARD