Title:
MANUFACTURE OF NICKEL PLATED NONWOVEN ELECTRODE SUBSTRATE
Document Type and Number:
Japanese Patent JPH08203534
Kind Code:
A
Abstract:
PURPOSE: To provide an electrode substrate subjected to uniform nickel electric plating by proposing a method for applying a quantity of conductivity treatment required for electric plating even to an inside in geometrically invisible sectional direction.
CONSTITUTION: When a web mainly composed of organic fibers is subjected to conductivity treatment by vacuum film forming method to become heat treated non-woven web, one time film forming quantity is restricted to perform film forming several times, and then a nickel plated non-woven electrode substrate characterized in its electric plating is produced.
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Inventors:
YAMADA JUN
SHINOHARA SEIJI
SHINOHARA SEIJI
Application Number:
JP1188895A
Publication Date:
August 09, 1996
Filing Date:
January 27, 1995
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
C25D7/00; D04H1/485; D06M11/00; D06M11/83; D21H27/00; H01M4/80; D06M101/00; D06M101/16; D06M101/18; D06M101/20; D06M101/22; (IPC1-7): H01M4/80; C25D7/00; D04H1/48; D06M11/83; D21H27/00
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