PURPOSE: To provide a method for manufacturing an optical head which can be mounted with high precision on a wiring substrate of a module having a light emitting element chip equipped with a light emitting body to be formed on a semiconductor substrate having a recognizing section and an IC driver chip.
CONSTITUTION: In a method for manufacturing an optical head having a module consisting of a light emitting element chip and an IC driver chip, the light emitting element chip forms a plurality of light emitting parts (P type-GaAsP layer) 306 on a semiconductor substrate 300 to be a light emitting body. At a P/N connection part to be the light emitting parts 306, a step is formed by etching. The light emitting parts 306 are directly recognized by an image pickup device so as to mount the module on a wiring substrate.
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NOBORI MASAHARU
SHIYOU ITSUCHIYOU
FUJIWARA HIROYUKI
OGIWARA MITSUHIKO
YANAKA MASUMI
